The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints
نویسنده
چکیده
A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing at 150 C in a number of studies. The numerical simulation was used to calculate the maximum flux of Au to the interface, and with the assumption that this Au was immediately incorporated in to Au0.1Ni0.1Sn0.8, a maximum rate of formation of Au0.1Ni0.1Sn0.8 was calculated. This rate was found to be similar to measured rates of formation of Au0.1Ni0.1Sn0.8 from two different studies. The formation of (CuNi)6Sn5 in Sn-AgCu/Ni solder interconnects was discussed within the context of these observations.
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تاریخ انتشار 2001